LEISTUNGSVERZEICHNIS
| Unnamed: 0 | LEISTUNGSVERZEICHNIS / Tender Specification | Unnamed: 2 | Unnamed: 3 | Unnamed: 4 | Unnamed: 5 | Stand: 25.03.2026 | Unnamed: 7 | Unnamed: 8 |
|---|---|---|---|---|---|---|---|---|
| Banf-Nummer/order request no.: | PR 1212932 | |||||||
| Anzahl/quantity: | 1 Stück / 1 pieces | |||||||
| Gerätesteckbriefnummer/device profile no: | ENAS-11-1-c | |||||||
| Auftragsgegenstand/order subject: | Wafer Burn In Test | |||||||
| KURZE BESCHREIBUNG DER LEISTUNG/ BRIEF SERVICE DESCRIPTION: | ||||||||
| The specification describes the requirements of a semiconductor test system to be used for characterization and burn in test of SiC and GaN wafer technology. The system must enable high parallel stress testing directly on wafers under defined bias and temperature conditions. The system must be able to perform burn in techniques such as HTRB, HTGB and functional burn in for proper characterization of latent defects and failure mechanisms. The system must enable full data traceability per die and have proper integration systems for reliable testing. | ||||||||
| Legende Kriterien/legend criteria | ||||||||
| B | Bewertung: Leistungsverzeichnispositionen, die mit einem B gekennzeichnet sind, dienen der Bewertung einzelner Kriterien. Die maximal erreichbare Punktzahl für das einzelne Kriterium ist in Spalte G aufgelistet. Eine Nichterfüllung oder keine Angaben führen zum sofortigen Ausschluss. Evaluation: The positions of service specification marked with B are used to evaluate individual criteria. The maximum achievable score for each criterion is listed in column J. Non-compliance or no information will result in immediate exclusion. | |||||||
| F | Forderung: Leistungsverzeichnispositionen, die mit einem F gekennzeichnet sind, müssen zwingend erfüllt werden. Das bedeutet für den Bieter, dass im Angebot dazu Angaben zu erstellen sind. Eine Nichterfüllung oder keine Angaben führen zum sofortigen Ausschluss. Requirement: The positions of service specification marked with F must be fulfilled. The information must be provided in the offer. Non-compliance or no information will result in immediate exclusion. | |||||||
| O | Option: Leistungsverzeichnispositionen, die mit einem O gekennzeichnet sind, dienen ebenfalls der Bewertung einzelner Kriterien. Die maximal erreichbare Punktzahl für das einzelne Kriterium ist in Spalte G aufgelistet. Optionen nicht anzubieten, führt jedoch nicht zum Ausschluss. Eine nicht angebotene Option wird mit 0 Punkten bewertet. Option: Specification items marked with an “O” are also used to evaluate individual criteria. The maximum number of points available for each criterion is listed in column G. However, failure to offer an option does not result in disqualification. An option that is not offered is awarded 0 points. | |||||||
| I | Information: Leistungsverzeichnispositionen, die mit einem I gekennzeichnet sind, fließen nicht in die Wertung ein. Diese dienen der Übermittlung von Informationen. Diese Positionen müssen zwingend beachtet werden. Sie führen nicht zum Ausschluss. Information: The positions of service specification marked with I are not included in the evaluation. They are used for the transmission of information, which must be observed and do not result in exclusion. | |||||||
| N | Nachhaltigkeit: Leistungsverzeichnispositionen, die mit einem N gekennzeichnet sind, dienen der Bewertung der Nachhaltigkeit als eigenes Zuschlagskriterium. Eine Nichterfüllung oder keine Angaben führen zum sofortigen Ausschluss. Sustainability: The positions of service specification marked with an N are used to assess sustainability as an award criteria. Non-compliance or no information will result in immediate exclusion. | |||||||
| LV Pos. / TS Pos. | TECHNISCHE BESCHREIBUNG - Hauptpunkt Technical description - main topic | TECHNISCHE BESCHREIBUNG - Beschreibung Technical description - specification | Anforderungen an die jeweiligen Parameter What is needed - parameter | B/F/O/I/N | max. Punktzahl B/O-Kriterien max. total points B / O-criteria | vom Bieter auszufüllen / to be filled by tenderer | Verweis in Bieterdokument / Reference in tenderer document | |
| 1.1 | General System Requirements | Wafer level Burn in and reliability test system for SiC and GaN Power Devices on Wafer level | F | |||||
| 1.2 | General System Requirements | Functional Burn In Test | High Temperature Gate Bias (HTGB) & High Temperature Reverse Bias (HTRB) Test Capability | F | ||||
| 1.3 | General System Requirements | Operating Temperature Range | Continous operation from Ambient(25°C) to 150°C, higher capability will get more points | B | 5 | |||
| 2.1 | Wafer Testing Requirements | Multi Wafer Capability | Capability to stress at least one wafer/chuck 4 Points to be given if supplier can test more than 1 chuck. | B | 2 | |||
| 2.2 | Wafer Testing Requirements | Wafer Size Compatibility | at least 200 mm wafer, more wafer sizes (100, 150 and /or 300 mm) rated better | B | 6 | |||
| 2.3 | Wafer Testing Requirements | Device Technologies | System must be suitable for testing SiC and GaN component technology. | F | ||||
| 2.4 | Wafer Testing Requirements | Types of DUT | Full wafer testing via a probecard/contactor. | F | ||||
| 2.5 | Wafer Testing Requirements | DUT Flexibility | Points to be awarded if the system can test dies and modules in addition to the wafer capability | B | 8 | |||
| 3.1 | Electrical Testing Capability (HTGB) | Maximum Number of Dies to be tested in parallel for Gate Stress Test per wafer | Atleast 1000, more will be better rated | B | 9 | |||
| 3.2 | Electrical Testing Capability (HTGB) | Min Voltage of Gate Voltage Power Supply for Gate Stress | Atleast -15 V, lesser will be better rated | B | 9 | |||
| 3.3 | Electrical Testing Capability (HTGB) | Max Voltage of Gate Voltage Power Supply for Gate Stress | Atleast 30 V , more will be better rated | B | 9 | |||
| 3.4 | Electrical Testing Capability (HTRB) | Maximum Number of Dies to be tested in parallel for Drain Stress Test per wafer | At least 700, more will be better rated | B | 8 | |||
| 3.5 | Electrical Testing Capability (HTRB) | Voltage of DrainSource Voltage for Drain Stress Test | Atleast 1200 V, more will be better rated | B | 8 | |||
| 3.6 | Electrical Testing Capability | DUT protection and site isolation for short circuit protection | System shall provide over current and over voltage protection per site and describe the protection concept and electrical acceptable levels for protection | F | ||||
| 3.7 | Electrical Testing Capability | Maximum Configurable I/O per wafer for test | at least 900 I/O channels , more points to be awarded if more channels per wafer | B | 10 | |||
| 3.8 | Electrical Testing Capability | Max Current per channel | Should be able to handle atleast 1 Amp per channel, more will be better rated | B | 8 | |||
| 4.1 | Measurement Requirements | Supported Parameteric Measurements | System must support static parametric measurements on wafer level such as VGS, BVDSS, IDSS, IGSS, VGSth, etc. Measurements before, during and after stress to be preferred | F | ||||
| 4.2 | Measurement Requirements | Per Die Monitoring | The system must support per die monitoring to ensure there is no effect to neighbor die or the system | F | ||||
| 4.3 | Measurement Requirements | Leakage monitoring | The system must be able to monitor and measure leakage gate and drain currents with proper resolution and accuracy | F | ||||
| 5.1 | Handling Requirements | Wafer Contact Technology | The system shall provide a solution to contact all required pads of the devices and state the technology required in detail with contact type, interface, electrical and thermal limits | F | ||||
| 5.2 | Handling Requirements | Use of External Wafer Prober | Use of an external prober instrument such as wafer prober should be clearly stated with all capabilities and aligned for information to integrate such a system | I | ||||
| 5.3 | Handling Requirements | Contacts per wafer | The system must be able to handle atleast 30000 reliable contacts per wafer , more will be better rated | B | 10 | |||
| 6.1 | Software & Data | Data Traceability and Wafer Map Integration | System must provide full data traceability of all stress and measurement data per die, per wafer and per lot and must support import and export of wafer maps. | F | ||||
| 6.2 | Software & Data | Data Export | System shall be able to export result files in different data export formats such as CSV, STDF, etc. | F | ||||
| 6.3 | Software & Data | Reporting and Analysis Tools | The system shall be able to do integrated analysis and reporting with easy integration. | F | ||||
| 6.4 | Software & Data | Remote Monitoring and External Connectivity | Optional remote access and monitoring capabilities with equipment interfaces. | F | ||||
| 7.1 | Installation Requirements | Main Power Supply | 230V or 400V AC, without transformer | F | ||||
| 7.2 | Installation Requirements | Power Consumption during operation | in kW, lower values rated better | N | 25 | |||
| 7.3 | Installation Requirements | Power ConsumptionStand by | in kW, lower values rated better | N | 25 | |||
| 7.4 | Installation Requirements | CDA consumption | average flow in l/min, lower values rated better | N | 25 | |||
| 7.5 | Installation Requirements | CDA consumption | maximal flow in l/min, lower values rated better | N | 25 | |||
| 7.6 | tool move in | requirements and restrictions for tool move in | see Appendix 1 | F | ||||
| 8.1 | Additional Requirements | Application support per e-mail or telephone must be included | Yes | F | ||||
| 8.2 | Additional Requirements | A complete training for at least 2 engineers for the programming/ usage of the software tools must be included. | Yes, atleast 2 engineers, more points awarded for more engineers | B | 2 | |||
| 8.3 | Additional Requirements | A complete training for at least 2 engineers for the operation/ usage of the system must be included. | Yes, atleast 2 engineers, more points awarded for more engineers | B | 2 | |||
| 8.4 | Additional Requirements | The training location must be online or to be conducted onsite in Germany | Yes | F | ||||
| 8.5 | Additional Requirements | The tool is shipped with a protocol conforming the electrical safety. | Yes | F | ||||
| 8.6 | Additional Requirements | The calibration can be done by the user. A manual for calibration and adjustment has to be included. Alternatively, the calibration is done by the vendor. | Yes | F | ||||
| 8.7 | Additional Requirements | The system should not have to be calibrated by external support more than once every six months. | Yes | F | ||||
| 9.1 | Uptime/Repair/Reliability | Service on-site response time | 72h (Mo- Fr) shorter time rated better | B | 4 | |||
| 10.1 | Schedule | Hardware Installation | information about installation time | I | ||||
| 10.2 | Schedule | Process start-up and Process acceptance testing | I | |||||
| 11.1 | Warranty | A 12 month warranty should be offered. During the warranty period all support, repair and parts cost should be covered. | Yes | F | ||||
| 12.1 | Service | After expiration of warranty a service contract possibility | service plan and information about costs | I |
Anhänge zum LV
| Anhänge zum LV /Appendices to the LV | Unnamed: 1 | Unnamed: 2 |
|---|---|---|
| Banf-Nummer/order request no.: | PR 1212932 | |
| Anzahl/quantity: | 1 Stück / 1 pieces | |
| Gerätesteckbriefnummer/device profile no: | ENAS-11-1-c | |
| Auftragsgegenstand/order subject: | Wafer Burn In Test | |
| LV Pos. / TS Pos. | TECHNISCHE BESCHREIBUNG - Hauptpunkt Technical description - main topic | Anhänge zum LV /Appendices to the LV |
| 7.6 | tool move in | Appendix 1 |
Appendix 1
| This section only deals with local conditions. Supplier agreements or general transport regulations are regulated individually (e.g. access routes, possible division of packing components, weights, delivery contracts, order confirmations). |
|---|
| Delivery and material lock |
| The maximum dimensions and mass of the transport packaging are as follows in order to bring the packaging into the ENAS material lock and bring it to clean room level (freight elevator): |
| Dimensions of the heavy-duty elevator |
| Width: 2156 mm |
| Height: 2500 mm |
| Depth: 2755 mm |
| Mass: 4000 kg |
| Placing in the clean room |
| The transport packaging is broken down into smaller parts in the material lock. |
| The following maximum dimensions and masses apply when placing the system or components in the clean room: |
| Width: 1700 mm |
| Height: 2100mm |
| Mass: 2635 kg (with pallet truck) |